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DATA SHEET
MOS FIELD EFFECT TRANSISTOR
PA1755
SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE
PACKAGE DRAWING (Unit : mm)
8 5 1 ; Source 1 2 ; Gate 1 7, 8 ; Drain 1 3 ; Source 2 4 ; Gate 2 5, 6 ; Drain 2 1 4 5.37 Max.
+0.10 -0.05
DESCRIPTION
This product is Dual N-channel MOS Field Effect Transistor designed for DC/DC converters and power management applications of notebook computers.
FEATURES
* Dual chip type * Low on-resistance RDS(on)1 = 32 m MAX. (VGS = 10 V, ID = 3.5 A)
1.44
6.0 0.3 4.4 0.8
* Low input capacitance Ciss = 895 pF TYP. * Built-in G-S protection diode * Small and surface mount package (Power SOP8)
1.8 Max.
RDS(on)2 = 45 m MAX. (VGS = 4.5 V, ID = 3.5 A)
0.15
0.05 Min.
0.5 0.2 0.10
1.27 0.40
0.78 Max. 0.12 M
ORDERING INFORMATION
PART NUMBER PACKAGE Power SOP8
+0.10 -0.05
EQUIVALENT CIRCUIT
(1/2 Circuit)
Drain
PA1755G
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, All terminals are connected.)
Drain to Source Voltage (VGS = 0) Gate to Source Voltage (VDS = 0) Drain Current (DC) Drain Current (pulse)
Note1 Note2 Note2
VDSS VGSS ID(DC) ID(pulse) PT PT Tch Tstg
30 20 7.0 28 1.7 2.0 150 -55 to + 150
2
V V A A W W C C
Gate
Body Diode
Total Power Dissipation (1 unit) Total Power Dissipation (2 unit) Channel Temperature Storage Temperature
Gate Protection Diode
Source
Notes 1. PW 10 s, Duty cycle 1 % 2. TA = 25 C, Mounted on ceramic substrate of 2000 mm x 1.1 mm Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. G12715EJ1V0DS00 (1st edition) Date Published March 1999 NS CP(K) Printed in Japan
(c)
1998
PA1755
ELECTRICAL CHARACTERISTICS (TA = 25 C, All terminals are connected.)
CHARACTERISTICS Drain to Source On-state Resistance SYMBOL RDS(on)1 RDS(on)2 Gate to Source Cut-off Voltage Forward Transfer Admittance Drain Leakage Current Gate to Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate to Source Charge Gate to Drain Charge Body Diode forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS(off) | yfs | IDSS IGSS Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr TEST CONDITIONS VGS = 10 V, ID = 3.5 A VGS = 4.5 V, ID = 3.5 A VDS = 10 V, ID = 1 mA VDS = 10 V, ID = 3.5 A VDS = 30 V, VGS = 0 VGS = 20 V, VDS = 0 VDS = 10 V VGS = 0 f = 1 MHz ID = 3.5 A VGS(on) = 10 V VDD = 15 V RG = 10 ID = 7.0 A VDD = 24 V VGS = 10 V IF = 7.0 A, VGS = 0 IF = 7.0 A, VGS = 0 di/dt = 100 A/s 895 335 150 16 130 55 30 19 2.2 5.4 0.8 45 62 1.5 4.0 MIN. TYP. 22 32 2.0 8.0 10 10 MAX. 32 45 2.5 UNIT m m V S
A A
pF pF pF ns ns ns ns nC nC nC V ns nC
TEST CIRCUIT 1 SWITCHING TIME
D.U.T. RL
VGS VGS
Wave Form
TEST CIRCUIT 2 GATE CHARGE
D.U.T. IG = 2 mA PG.
90 % 90 % ID
PG.
RG RG = 10
0 ID
10 %
VGS (on)
90 %
RL VDD
VDD
50
VGS 0 t t = 1 s Duty Cycle 1 %
ID
Wave Form
0
10 % td (on) ton tr td (off) toff
10 % tf
2
Data Sheet G12715EJ1V0DS00
PA1755
TYPICAL CHARACTERISTICS (TA = 25 C)
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1 000
rth(t) - Transient Thermal Resistance - C/W
100
10
1
0.1
0.01 0.001
Mounted on ceramic substrate of 2000mm2 x 1.1mm Single Pulse, 1 unit
10
100
1m
10 m
100 m
1
10
100
1 000
PW - Pulse Width - s
RDS(on) - Drain to Source On-state Resistance - m
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 70 60 50 40 30 20 10 0 5 10 15 ID=3.5 A Pulsed
|yfs| - Forward Transfer Admittance - S
100 TA=-50C TA=-25C TA= 25C
VDS=10V Pulsed
10
1
TA=75C TA=125C TA=150C
0.1
1
10
100
ID- Drain Current - A
VGS - Gate to Source Voltage - V
RDS(on) - Drain to Source On-state Resistance - m
VGS(off) - Gate to Source Cut-off Voltage - V
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT Pulsed 70 60 50 40 30 20 10 0 1 10 ID - Drain Current - A 100 VGS=10V VGS=4.5V
GATE TO SOURCE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE 2.4 VDS=10 V ID=1 mA
2.0
1.6
1.2
0.8 - 50 0 50 100 150
Tch - Channel Temperature - C
Data Sheet G12715EJ1V0DS00
3
PA1755
RDS(on) - Drain to Source On-state Resistance - m
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE
SOURCE TO DRAIN DIODE FORWARD VOLTAGE Pulsed
IF - Diode Forward Current - A
80
ID= 3.5 A 100 VGS=10V 10
60
40 VGS=4.5V 20 VGS=10V
1
VGS=0V
0.1 0 0.5 1.0 1.5
0
- 40
0
40
80
120
Tch - Channel Temperature - C
VSD - Source to Drain Voltage - V
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 10000
SWITCHING CHARACTERISTICS 1000
td(on), tr, td(off), tf - Switching Time - ns
Ciss, Coss, Crss - Capacitance - pF
VGS = 0 f = 1 MHz
tr
1000
Ciss Coss
100
tf td(off) td(on)
100
Crss
10
10 0.1
1
10
100
1 0.1
1
10
VDS = 15 V VGS = 10 V RG = 10 100
VDS - Drain to Source Voltage - V
ID - Drain Current - A
REVERSE RECOVERY TIME vs. DRAIN CURRENT 1000
trr - Reverse Recovery Diode - ns
VDS - Drain to Source Voltage - V
30
100
VDD=24 V VDD=15 V VDD=6 V
VGS
12 10 8 6
20
10
10
4 2
1 0.1
1
10
100
0
5
10
15
20
0
ID - Drain Current - A
QG - Gate Charge - nC
4
Data Sheet G12715EJ1V0DS00
VGS - Gate to Source Voltage - V
di/dt = 100 A/s VGS = 0
DYNAMIC INPUT/OUTPUT CHARACTERISTICS 40 ID = 7 A 14
PA1755
DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
PT - Total Power Dissipation - W/package
2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 20 40 60 80 2 unit 1 unit
dT - Percentage of Rated Power - %
100 80 60 40 20
Mounted on ceramic substrate of 2000mm2x1.1mm
0
20
40
60
80
100 120 140 160
100 120 140 160
TA - Ambient Temperature - C
TA - Ambient Temperature - C
FORWARD BIAS SAFE OPERATING AREA 100
ID(pulse) = 28 A d ite Lim V) n) (o 10 S= RD GS (V ID(DC) = 7 A
DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE Pulsed
Mounted on ceramic substrate of 2000mm2x1.1mm, 1 unit
20
VGS=10 V
ID - Drain Current - A
10
PW
=1
=1
m
ID - Drain Current - A
PW
=1
s
VGS=4.5 V VGS=4 V 10
Po we r
1
PW
0m
s
Di
ss
00
ipa
m
tio
s
n
Lim
0.1 0.1
TA = 25 C Single Pulse 1
ite
d
100 0 0.2 0.4 0.6 0.8
10
VDS - Drain to Source Voltage - V
VDS - Drain to Source Voltage - V
FORWARD TRANSFER CHARACTERISTICS 100 Pulsed
ID - Drain Current - A
10
1
TA=150C TA=125C TA=75C
0.1
TA=25C TA=-25C TA=-50C VDS = 10 V
1
2
3
4
5
VGS - Gate to Source Voltage - V
Data Sheet G12715EJ1V0DS00
5
PA1755
[MEMO]
6
Data Sheet G12715EJ1V0DS00
PA1755
[MEMO]
Data Sheet G12715EJ1V0DS00
7
PA1755
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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